Download or read book 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) written by IEEE Staff and published by . This book was released on 2015-06-29 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism