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Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional
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Type: BOOK - Published: 2018-11-15 - Publisher: Woodhead Publishing
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures an
Language: en
Pages: 617
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Type: BOOK - Published: 2020-04-01 - Publisher: Elsevier
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Type: BOOK - Published: 2004-02-27 - Publisher: CRC Press
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end a