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ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Language: en
Pages: 666
Authors: ASM International
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-01 - Publisher: ASM International

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The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate i
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Language: en
Pages: 540
Authors: ASM International
Categories: Technology & Engineering
Type: BOOK - Published: 2019-12-01 - Publisher: ASM International

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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Language: en
Pages: 719
Authors: Tejinder Gandhi
Categories: Technology & Engineering
Type: BOOK - Published: 2019-11-01 - Publisher: ASM International

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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM I
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Language: en
Pages: 593
Authors: ASM International
Categories: Technology & Engineering
Type: BOOK - Published: 2018-12-01 - Publisher: ASM International

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The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to Novembe
3D Microelectronic Packaging
Language: en
Pages: 629
Authors: Yan Li
Categories: Technology & Engineering
Type: BOOK - Published: 2020-11-23 - Publisher: Springer Nature

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture,