Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel

Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical sy