The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, d

Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologie

An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.