Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Author :
Publisher : McGraw-Hill Professional Publishing
Total Pages : 440
Release :
ISBN-10 : UOM:39015041017537
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by : John H. Lau

Download or read book Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale package (CSP), and solder-bumped flip chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. For these technologies, solder is the electrical and mechanical "glue," and thus solder joint reliability is one of the most critical issues in the development of these technologies. This book is a one-stop guide to the state of the art of solder joint reliability problem-solving methods, or choose a creative, high-performance, robust, and cost-effective design and high-yield manufacturing process for their interconnect systems will be able to do so with this unique sourcebook. It meets the reference needs of design, material, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, vendor, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. This book is structured to provide readers with the necessary know-how for practical, on-the-job problem-solving guidance. The book covers the solder joint reliability of BGA, CSP, flip chip, and FPT assemblies completely, proceeding from the theoretical basics to applications. Specific areas covered include: Definition of reliability, life distribution, failure rate, mean time to failure, etc.; Some well-known life distributions; Accelerated testing; Parameter estimation of life distributions; Acceleration factors for solders;Solder mechanics: plasticity, creep, and constitutive equations; Design, material, and manufacturing processes of BGA, CSP, flip chip, and FTP; Failure analysis and root cause of failure for BGA, CSP, flip chip, and FPT solder joints; Design for reliability of BGA, CSP, flip chip and FPT solder joints; Solder joint reliability of CBGA, PBGA, DBGA, and TBGA assemblies under thermal fatigue, mechanical bending and twisting, and shock and vibration conditions; solder joint reliability of flip chip (e.g., high-temperature and eutectic solder bumped flip chips on ceramic and PCB) assemblies under thermal fatigue, mechanical pulling, shearing, bending and twisting, and shock and vibration conditions; Solder joint reliability of CSP (e.g., LG Semicon's, Mitsubishi's, Motorola's, Tessera's, NEC's, nitto Denko's and Toshiba's) assemblies under thermal fatigue and mechanical bending conditions; Solder joint reliability of PQFP and TSOP assemblies under thermal fatigue, mechanical bending and twisting, and vibration conditions.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies Related Books

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Language: en
Pages: 440
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 1997 - Publisher: McGraw-Hill Professional Publishing

GET EBOOK

The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chi
Low Cost Flip Chip Technologies
Language: en
Pages: 616
Authors: John H. Lau
Categories: Business & Economics
Type: BOOK - Published: 2000 - Publisher: McGraw-Hill Professional Publishing

GET EBOOK

Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distributi
Chip Scale Package (CSP)
Language: en
Pages: 600
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 1999 - Publisher: McGraw Hill Professional

GET EBOOK

Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of wor
Assembly and Reliability of Lead-Free Solder Joints
Language: en
Pages: 545
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2020-05-29 - Publisher: Springer Nature

GET EBOOK

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight place
Reflow Soldering Processes
Language: en
Pages: 282
Authors: Ning-Cheng Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2002-01-11 - Publisher: Newnes

GET EBOOK

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i