In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,

With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits o

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical en

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor i