Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution

Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution
Author :
Publisher :
Total Pages : 206
Release :
ISBN-10 : 8449055164
ISBN-13 : 9788449055164
Rating : 4/5 (164 Downloads)

Book Synopsis Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution by : Luis Alberto Navarro Melchor

Download or read book Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution written by Luis Alberto Navarro Melchor and published by . This book was released on 2015 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 oC melting point) using low process temperature (

Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution Related Books

Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution
Language: en
Pages: 206
Authors: Luis Alberto Navarro Melchor
Categories:
Type: BOOK - Published: 2015 - Publisher:

GET EBOOK

Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers t
Evaluation of die-attach materials for high temperature power electronics applications and analysis of the Ag particles sintering solution
Language: ca
Pages: 201
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Language: en
Pages: 279
Authors: Kim S. Siow
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-29 - Publisher: Springer

GET EBOOK

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment req
Harsh Environment Electronics
Language: en
Pages: 400
Authors: Ahmed Sharif
Categories: Technology & Engineering
Type: BOOK - Published: 2019-03-19 - Publisher: John Wiley & Sons

GET EBOOK

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the
Interface Circuits for Microsensor Integrated Systems
Language: en
Pages: 171
Authors: Giuseppe Ferri
Categories: Electronic books
Type: BOOK - Published: 2018-12-07 - Publisher: MDPI

GET EBOOK

This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines